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电磁兼容原理与工程应用(英文版)

电磁兼容原理与工程应用(英文版)

作者:赵阳等
出版社:科学出版社出版时间:2022-05-01
开本: B5 页数: 232
本类榜单:工业技术销量榜
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电磁兼容原理与工程应用(英文版) 版权信息

  • ISBN:9787030673916
  • 条形码:9787030673916 ; 978-7-03-067391-6
  • 装帧:一般胶版纸
  • 册数:暂无
  • 重量:暂无
  • 所属分类:>

电磁兼容原理与工程应用(英文版) 本书特色

以精炼的语言,严谨的结构安排、丰富的应用案例将电磁兼容原理和应用清晰地呈现给读者。

电磁兼容原理与工程应用(英文版) 内容简介

本书系统介绍了电磁兼容技术的基本知识、概念,以及国内外电磁兼容的技术标准,着重从工程实践的角度阐述电磁干扰噪声产生机理与应对策略。全书内容包括:电磁兼容工程基础知识;传导电磁干扰(CE)问题机理分析;辐射电磁干扰(RE)问题机理分析;电磁抗扰度(EMS)问题机理分析;电磁兼容问题应对策略以及电磁兼容工程应用(含电磁干扰(EMI)问题处理方法、电磁抗扰度(EMS)问题处理方法及工程案例分析)等。全书内容丰富,深入浅出,具有较强的实用性,将基础理论与工程应对策略与解决方法相结合,具有一定的工程指导实践性。

电磁兼容原理与工程应用(英文版) 目录

Contents
Chapter 1 Introduction of Electromagnetic Compatibility 1
1.1 Electromagnetic Compatibility History and Basic Concepts 1
1.2 Electromagnetic Compatibility Standards and Measurement 2
1.2.1 FCC Standard 3
1.2.2 CISPR Standard 3
1.2.3 GB Standard 4
1.3 Electromagnetic Compatibility Terminology 4
References 6
Chapter 2 Conducted EMI Noise Generation Mechanism, Measurement and Diagnosis 7
2.1 Generation Mechanism and Analysis of Conducted EMI Noise 7
2.1.1 Common Mode and Differential Mode Definition 7
2.1.2 Conducted EMI Noise Generation Mechanism 8
2.1.3 Equivalent Circuit of Conducted EMI Noise 13
2.2 Conducted EMI Noise Measurement Method 15
2.2.1 Line Impedance Stabilization Network Structure 15
2.2.2 LISN Metrology Characteristic Parameters 17
2.2.3 Calibration of Measurement Characteristic Parameters 20
2.3 Diagnosis of Conducted EMI Noise 23
2.3.1 Principles of Conducted EMI Noise Diagnosis 23
2.3.2 Noise Separation Network 27
2.3.3 Noise Separation Network Characteristics Measurement Method 30
2.3.4 Experimental Verification 33
References 34
Chapter 3 Conducted EMI Noise Suppression Methods and Cases Study 35
3.1 Suppression Principle of Conducted EMI Noise 35
3.1.1 Internal Noise Suppression 35
3.1.2 External Noise Suppression 37
3.2 Suppression Methods of Conducted EMI Noise 40
3.2.1 Ground 40
3.2.2 Conducted EMI Noise Suppression Devices 51
3.2.3 EMI Filter 57
3.3 Suppression Case Study of Conducted EMI Noise 67
3.3.1 Case #No.1 67
3.3.2 Case #No.2 73
References 77
Chapter 4 Radiated EMI Noise Generation Mechanism, Measurement and Diagnosis 78
4.1 Generation Mechanism and Analysis of Radiated EMI Noise 78
4.1.1 Common Mode and Differential Mode Definition 78
4.1.2 Radiated EMI Noise Generation Mechanism 83
4.1.3 Equivalent Circuit of Radiated EMI Noise 88
4.2 Radiated EMI Noise Measurement Method 93
4.2.1 Anechoic Chamber Classification and Working Principles 93
4.2.2 Radiated EMI Noise Measurement Equipment and Composition 95
4.2.3 Radiation Emission Limitation 98
4.2.4 Requirements of the Device Under Test 99
4.3 Diagnosis of Radiated EMI Noise 100
4.3.1 Principles of Radiated EMI Noise Diagnosis 100
4.3.2 Near-field Wave Impedance Measurement for Radiated EMI Noise Diagnosis 103
References 105
Chapter 5 Radiated EMI Noise Suppression Methods and Cases Study 107
5.1 Suppression Principles of Radiated EMI Noise 107
5.1.1 Common Mode Suppression Principles 107
5.1.2 Differential Mode Suppression Principles 108
5.2 Suppression Methods and Analysis of Radiated EMI Noise 109
5.2.1 Common Mode Suppression Method 109
5.2.2 Differential Mode Suppression Method 131
5.3 Case Study 134
5.3.1 Case Study 1 134
5.3.2 Case Study 2 138
References 145
Chapter 6 Principle and Analysis of EMS: Static Electricity Mechanism and Protection 146
6.1 ESD Generation Mechanism 146
6.2 Electrostatic Protection Theory 148
6.2.1 Implementation Standards and Test Methods of ESD 148
6.2.2 ESD Suppression Device 152
6.2.3 ESD Suppression Method 156
6.3 ESD Case Study 1 163
6.3.1 Product Introduction 163
6.3.2 Problem Description 163
6.3.3 Problem Diagnosis and Analysis 164
6.3.4 Modification Measures and Theoretical Analysis 164
6.3.5 Final Modification Results 166
6.3.6 Summary 166
6.4 ESD Case Study 2 167
6.4.1 Problem Description and Diagnosis 167
6.4.2 ESD Protection Scheme 168
6.4.3 Experimental Results and Analysis 170
References 171
Chapter 7 Principle and Analysis of EMS: EFT Mechanism and Protection 173
7.1 Formation Mechanism of EFT 173
7.1.1 Mechanism and Analysis of EFT 173
7.1.2 EFT Interference Mechanism 176
7.2 EFT Protection Theory 177
7.2.1 EFT Standardization and Testing Methods 177
7.2.2 EFT Restraint Measures 182
7.3 Principle and Analysis of EMS: EFT Case Analysis 185
7.3.1 Analysis of EFT Case 1 185
7.3.2 Analysis of EFT Case 2 191
References 196
Chapter 8 Introduction of Other EMI Issues: CS, RS and Surge 198
8.1 Conducted Interference Susceptibility (CS) 198
8.1.1 Generation Mechanism and Analysis of CS 198
8.1.2 Implementation Standards and Test Methods of CS 198
8.2 Radio Frequency Electromagnetic Field Susceptibility (RS) 200
8.2.1 Generation Mechanism and Analysis of RS 200
8.2.2 Implementation Standards and Test Methods of RS 201
8.2.3 Test System and Test Method of Radiation Susceptibility in Anechoic Chamber 212
8.3 Lightning Surge 215
8.3.1 Generation Mechanism and Analysis of Lightning Surge 215
8.3.2 Implemental Standards and Test Methods of Lightning Surge 217
References 223
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电磁兼容原理与工程应用(英文版) 节选

Chapter 1 Introduction of Electromagnetic Compatibility   1.1 Electromagnetic Compatibility History and Basic Concepts   During the Second World War, the use of electronic equipment, especially radio transceivers, navigation equipment and radars, led to an increase in the number of interference between radio transceivers and navigation equipment on aircraft by redistributing the frequency of the transmission over a non-congested spectrum, or by keeping the cable away from the noise source to prevent cables from receiving interference. The interference problem can usually be resolved easily. At that time, the density of the electronics (mainly the electronic vacuum tube) was far less than today. Therefore, it was easy to implement the modification of the interference on a case-by-case basis to solve the electromagnetic interference (EMI) problem.   However, with the invention of high-density electronic components, such as field effect transistors invented in the 1950s, integrated circuits (IC) invented in the 1960s, and microprocessor chips invented in the 1970s, the interference problem became increasingly serious. As the demands for voice and data transmission increase, the spectrum becomes more and more crowded, which requires reasonable planning of the spectrum usage[1].   Due to the increasing number of digital systems that interfere with wired and wireless communications, the US Federal Communications Commission (FCC) issued a regulation in 1979, requiring electromagnetic interference from all “digital devices” to be lower than a certain limit. The purpose of the regulation was to restrict “electromagnetic pollution”, to put an end to, or at least reduce the number of EMI cases. Because the digital devices sold in the United States had to meet the FCC mandatory restrictions, there was a strong interest in EMC disciplines among electronics manufacturers with products ranging from digital computers to electronic typewriters.   Many European countries had already enforced similar requirements for digital devices before the FCC promulgated the specifications. In 1933, the International Electrotechnical Commission (IEC) recommended the International Special Committee on Radio Interference (CISPR) to deal with emerging EMI issues at a meeting in Paris[1,2]. The committee published a document detailing the measurement equipment used to determine potential EMI problems. CISPR reconvened in London in 1946 after the Second World War. Subsequent meetings published various technical publications, discussed measurement techniques, and suggested the restrictions. Some European countries have adopted the restrictions of various versions recommended by CISPR. The FCC specification was the first one for digital systems in the United States. The restrictions were based on CISPR recommendations and were subject to the change in the U.S. environment. To prevent “field problems” associated with EMI, most electronics manufacturers had set internal limits and standards for their products in the United States. However, FCC specifications made such a voluntary act into a legal compliance program requirement.   These specifications have made EMC a key factor in market access for electronics. If a product does not meet the specifications in a certain country, it may not be sold in that country[2,3]. In other words, products that are fully functionally implemented cannot be purchased because they do not meet the specifications.   Work on electromagnetic compatibility started late in China and developed gradually from the 1970s. Some national standards and national military standards have been promulgated such as EMC design requirements and test methods, but the detailed design specifications are still lacking. The electromagnetic compatibility penetrates every electrical and electronic system and equipment. The electromagnetic compatibility problems can only be solved by management and coordination of overall design.   1.2 Electromagnetic Compatibility Standards and Measurement   Most electrical and electronic equipment, circuits and systems emit electromagnetic energy, either intentionally or unintentionally. This emission can generate electromagnetic interference. At the same time, many modern electronic devices, circuits, and equipment are capable of responding to or being affected by such electromagnetic interference. This problem has become more serious in modern semiconductor devices and VLSI circuits, which are prone to fail or even be completely damaged under electromagnetic interference because of their relatively low susceptibility thresholds for electromagnetic interference. Problems associated with electromagnetic emissions (generating electromagnetic interference) and equipment, subsystems, and devices against electromagnetic interference (electromagnetic compatibility) are common in the production and transmission of wireless broadcast, communications, control, information technology produ

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